By John H. Lau
The 1st entire, in-depth advisor to chip scale packaging, this reference supplies state of the art details at the most crucial new improvement in digital packaging for the reason that floor mount expertise (SMT). that includes the most recent layout concepts, plus information on greater than forty kinds of CSP, Chip Scale package deal arms engineers and architects the total, expert set of operating instruments that they should resolve technical and layout matters; locate the best, within your means CSP strategies for his or her deployments; resolution questions about interfacing, pace, robustness, and extra; examine houses of wirebonds, turn chips, inflexible and flex substrates, wafer-level redistribution, and different CSP items; get the most recent info on new choices from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, nationwide Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and different significant businesses; and find out about CSP items below improvement. A revolution in electronics, CSP is taking the electronics through hurricane. web page after web page, this standard-setting advisor grants either crucial technical information and an eye-opening evaluate of this fast-developing box. irrespective of the way you use Chip Scale package deal, youOll see why itOs the source of selection in the event you are looking to be on the best of the sport.
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Additional resources for Chip Scale Package: Design, Materials, Process, Reliability, and Applications
1 in order to further integrate the process with other nano- or microfabrication processes for device fabrication, as discussed in Chapter 4. We organize the fabrication methods according to their growth conditions. In the first three sections, we discuss different NSTF fabrication techniques in the gas phase and the liquid phase and through templates. In the last section, we give a detailed description of a gas phase nanofabrication technique called the glancing angle deposition (GLAD) method.
It is further stated here that when one is designing a sensor or trying to choose the appropriate transduction technique there are a few questions one can ask, including: What is the measurand? What is the principle of transduction? What is the sensing element? What are the limits of the measurand to which the transducer will need to respond? J. Fortin GE Global Research Center. com A. Zribi and J. 1007/978-0-387-68609-7_2, © Springer Science + Business Media, LLC 2009 17 18 J. Fortin White has presented a classification scheme for measurands or properties one may be interested in measuring.
This kind of NSTF is usually prepared by conventional thin-film deposition techniques such as physical vapor deposition (PVD), chemical Y. edu A. Zribi and J. 1007/978-0-387-68609-7_3, © Springer Science + Business Media, LLC 2009 31 32 Y. 1 Process Conditions and NSTF Structures for NSTF Fabrication or Synthesis Fabrication or Synthesis Conditions NSTF Structures Approaches: bottom-up or top-down Mechanism: physical or chemical process Environment: gas or liquid phase Temperature: high or low Other factors, such as pressure, carrier gas, plasma, substrate, etc.