By Dana Crowe, Alec Feinberg
This publication is easily a powerful addition to the physique of information for Reliability pros and for any corporation that wishes to enhance the enterprise competitiveness via bettering the product reliability.
The ebook in actual fact presents the proper specialize in the client, however it additionally elaborates at the incontrovertible fact that one consumer is the company organization.
The publication indicates the optimal series of DfR actions within the improvement levels. This e-book additionally has amazing info for the categorical DfR components. it's also a very good source for information into particular info.
I just like the stability of photos with textual content and the portraits additional first-class extra understanding.
This is a phenomenal chief that has documented the carried out perform during this book.
I didn't try and be sure each mathematical formulation.
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Additional resources for Design for Reliability
4 Data Analysis Analysis of the data collected during constant stress life tests is performed at three levels: electrical behavior of each device, statistical behavior of all the devices stressed at a single condition, and statistical behavior of all the stress levels included in a semiconductor process reliability study. These analyses, combined with physical failure analysis, provide an understanding of the failure mechanisms exhibited by a process and the functional dependence of those mechanisms on the environmental conditions (stresses) applied during the life tests.
0 implies that the fix will eliminate the failure mode. 6), other possible fixes shall be considered and rated until the best possible solution is found. Validate the corrective action If time and money permit, the design should be fully retested with a statistically meaningful sample size as described in this document. If time and money do not permit, units should undergo partial testing to demonstrate capability with the approval of reliability engineering. If necessary, units may still require the implementation of a Test-Analyze-And-Fix (TAAF) reliability growth program.
Ionic Contamination Tests corrosion-related surface contamination of products. Environmental Stress Screening (ESS) One or more environmental tests for screening products prior to shipment. Vibration/Constant Acceleration Tests mechanical integrity of mounted components. Combined Stresses Tests interactive environmental problems. Humidity Tests for corrosion-related problems. Highly Accelerated Stress Test (HAST) A humidity environmental test to look for failures in the shortest time possible. ©2001 CRC Press LLC bon bonds when bonds lack proper stress relief, solder joint failures when intermetallics are present, surface-mount failures when process variations exist in solder volume, etc.